Wafers with thick, thermal oxidized films, ThickBOX® SOI Wafers and Structured SOI Wafers offered by KST World are popular with many customers as an entirely new material in the field of Micro-Electro-Mechanical Systems (MEMS).

Up to 20 µm thermal oxide

Structured SOI series

Examples

• Hard masks for etching:
  For MEMS, plated-through holes and deep engraving by the deep etching method are commonly used.
  Our thick, thermal oxidized films can be used as a hard mask for etching, as they meet the film thickness required to resist etching.
• Nanoimprint molds:
  Thermal oxidized films which are hard and yet easy to process are widely adopted as nanoimprint molds for MEMS. The molds height required of a structure can be accommodated by our thick films, making diverse applications possible.
  
• Acceleration sensors, actuators, cantilevers, and pressure sensors:
  Our ThickBOX® SOI Wafers are invaluable for acceleration sensors, actuators and other bulk-mode MEMS where buried oxidized films of SOI wafers are etched as the sacrificial layer.
  With a thick BOX being the sacrificial layer, sufficient clearance for actuations of structures can be secured, which solves sticking problems and vertically extends the area of actuations, improving process yield and enabling innovative devices to be developed.
  

  Furthermore, as our Structured SOI Wafers allow prior embedding of the customer’s own pattern, and so eliminating the processes of sacrificial layer etching and patterning from the back side, the process yield is increased and effects are improved.
  Our BOX Cavity SOI Wafers with pre-etched sacrificial layers reduce the cumbersome processes for customers.

  

  The BOX Cavity SOI Wafers that draw on the characteristics of KST World’s thick, thermal oxidized film technologies are optimal for MEMS devices having a diaphragm structure. They not only eliminate the etching process from the back side, but miniaturize chips and adjoin cavities of different sizes, allowing more advanced devices to be created.
  

  

  For devices having larger areas of actuations of structures, our Handle Cavity SOI Wafers allow deep engraving.
  Just like the BOX Cavity, customers can expect various benefits such as elimination of the etching process from the back side, miniaturization of chips and improved mechanical strength.

Our deposition process service are also highly reputed. For instance, with our technologies, it is possible to thermally process wafers that have been silicon-etched by customers and to form thick oxide films. Thus, KST World can respond to demands such as deposition of an insulation film on a hole pattern or embedding of thermal oxidized films.